UMC is a leading global semiconductor foundry. The company provides high quality IC production with a focus on both logic and specialty technologies to serve every major sector of the electronics industry. UMC’s comprehensive technology and manufacturing solutions include logic/RF, display driver IC, embedded flash, RFSOI/BCD, and IATF-16949 automotive manufacturing certification for all wafer fabs.



UMC operates 12 fabs that are located throughout Asia with a maximum capacity of more than 750,000 8-inch equivalent wafers per month. The company employs approximately 19,500 people worldwide, with offices in Taiwan, China, United States, Europe, Japan, Korea and Singapore.



UMC is a 300mm manufacturing leader with several advanced 300mm fabs in operation. Fab 12A in Tainan, Taiwan has been in volume production for customer products since 2002 and is currently manufacturing products down to 14nm. Fab 12A’s total production capacity is currently over 87,000 wafers per month. UMC’s second 300mm fab, Fab 12i, is located in Singapore’s Pasir Ris Wafer Park. This second-generation 300mm facility is also in volume production, with capacity at 50,000 wafers per month. UMC’s newest 300mm fab, United Semi in Xiamen, China, began volume production in Q4 2016. The total design capacity of United Semi is 50,000 wafers per month when fully equipped.


UMC’s geographically diversified 300mm manufacturing throughout Asia means customers can mitigate their manufacturing risk while still maintaining production within the same region to ensure seamless engineering support from UMC’s Taiwan headquarters.



Ultimately, UMC’s leadership in 300mm production results in increased cost-efficiency and faster time to market for our customers. As die size increases with more and more advanced technology features being integrated into today’s system on chip (SOC) designs, these factors become increasingly important for companies to maintain their competitiveness.

Back to Wafer Fabrication Plant (Fab)/Foundry